November 21-22, 2011
9am – 5pm
Ascott, Makati City
Fee: Php 15,000.00 / person plus 12% VAT
- Early Registration Payment: Ten-Percent (10%) Discount if PAID thirty (30) days before the training date
- Group Discount: Five-Percent (5%) on Three (3) or More Participants
SYNOPSIS
Engineering materials are the core of any engineering products. The performances of the products are determined by the behavior and characteristics of the designed materials according to their required specifications. Therefore, it is extremely important to understand the characteristics of the materials. This can be done by performing an appropriate characterization or testing on the materials. The information that is of interest is electrical, mechanical, thermal, optical, and chemical properties. To acquire those information, knowledge of characterization tools, limitation of the tools, and application of the tools is essential. By having this knowledge, it may help engineers and researchers to select a suitable tool for a specific purpose. The characterization tools that will be covered are suitable for materials in bulk and thin film form.
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Pre-requisites:
Basic technical background or working experience in a science or engineering discipline.
Objective of the Course:
Upon completion of this course, participants will be able:
- Discuss the basic requirements of selecting a characterization tool.
- Relate concepts of materials properties with performance.
- Explain different types of characterization tools for acquiring electrical, mechanical, optical, and chemical properties of engineering materials.
- Compare the advantages and disadvantages of each tools.
Who must attend:
- Technicians, engineers, and researchers
- Decision makers, policy makers, and managers
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Course Outline
- Introduction and general concept
- Mechanical Characterization
- Tension testing
- High-strain-rate testing
- Fracture toughness testing
- Hardness testing
- Tribological and wear testing
- Contact angle measurement
- Thermal Analysis
- Thermogravimetric analysis
- Differential thermal analysis
- Differential Scanning calorimetry
- Combustion calorimetry
- Thermal diffusivity measurement
- Electrical Measurement
- Conductivity measurement
- Hall effect measurement
- Capacitance-voltage measurement
- Current-voltage measurement
- Deep-level transient spectroscopy
- Optical Spectroscopy
- UV-Vis Spectroscopy
- Raman Spectroscopy
- Ellipsometry
- X-ray Techniques
- X-ray diffraction
- Chromatographic Techniques
- Ion exchange chromatography
- Gel permeation chromatography
- Gas chromatography
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DR CHEONG KUAN YEW
Kuan Yew Cheong was born in Ipoh , Perak (1972) and received the B. Eng (1st Hons.) in Materials Engineering from Universiti Sains Malaysia (USM), Malaysia in 1997. After graduation, he worked for two years as a project engineer and quality assurance engineer in a project management company and a semiconductor-device manufacturing factory in Malaysia.
End of 1999, he decided to pursue his postgraduate study (M.Sc.) after being awarded a Fellowship under the Academic Staff Training Scheme from USM. After completion his M.Sc. in Materials Engineering (Thin Film Technology) in 2001, he continued his Ph.D. in the School of Microelectronic Engineering , Griffith University , Australia and the degree was awarded in 2004. This study was fully sponsored by Australian Research Council, USM, and Griffith University Postgraduate Research Scholarship.
In 2005, he was awarded a Certificate of Teaching and Learning from USM. Now he is serving as an Associate Professor at the School of Materials & Mineral Resources Engineering. He is teaching courses of electronic materials, semiconductor fabrication technology, and quality control and management for more than 6 years at under- and post-graduate levels. Dr. Cheong’s main research area is on semiconductor device fabrication, electronic packaging, and characterization. The outcomes of his research have been published in more than 75 high-impact-factor journals and 3 book chapters. Due to his expertise in wide-bandgap semiconductor-based device fabrication technology, for the past six years, he has been invited three times as a Visiting Scientist to Korea Electrotechnology Research Institute (KERI), Korea.
He has also being invited as an Invited Speaker and Keynote Speaker in International Conference on Electronic Materials 2010 (ICEM 2010) – International Union of Materials Research Societies (IUMRS), Korea, CIE & IEM International Seminar on Electrical, Electronic and Energy Saving 2010, Taiwan, and Infineon Technologies (Kulim) Sdn Bhd (IFKM) Technical Symposium 2010, Malaysia. Recently, he has been invited to deliver a Talk on “Investigating Surface Coating and Corrosion Issues Using Surface Analysis (SA) Tools” in Surface Engineering 2011 at Bangkok , Thailand.
He is also a Professional Engineers in Material Engineering disipline who is registered under Board of Engineers, Malaysia.
Outside university, he is very active in professional and community activities. He is a member of Materials Research Society (USA). He was the honorary treasurer for Electron Microscopy Society , Malaysia for year 2005/2006.
Since 2005, he has been elected as one of the Ex-comms of the Institute of Electrical , Electronic Engineers (IEEE) – Component, Package, and Manufacturing Technology (CPMT) Society and Electron Device Society (EDS), Malaysia Chapter.
In addition, he is also the Chairman of the electronic engineering technical division (eETD) under The Institution of Engineers Malaysia (IEM) since 2009. Recently, he has been appointed as a Council Member of IEM and a Standing Committee on Qualification/Admission and Examination/Training.
For the past years, he has involved in organizing a number of local and international conferences and being invited to chair a few technical sessions in those conferences. He is also closely working with Industry through university-industry linkage program and he is delivering technical training courses for local and multinational electronics industries for the past 5 years and more than 350 engineers and researchers have been benefited from those courses.
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Banco de Oro (BDO)
Account Name: AGUILA GROUP COMPANIES (AGC) DEVELOPMENT CORPORATION
Account Number: (Peso) 00 222 800 0844
Bank Address: East Mansion Townhouse, Elisco Road, Sto Rosario, Pateros
United Coconut Planters Bank (UCPB)
Account Name: AGUILA GROUP COMPANIES (AGC) DEVELOPMENT CORPORATION
Account Number: (Peso) 00-123-002131-3
Bank Address: Aguirre Branch, 114 Pet Bldg., Aguirre St., Legaspi Village, Makati City
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