Semiconductor Devices Seminar

Estimated read time 5 min read

February 18-19, 2013
9am – 5pm
Ascott, Makati City

Fee: Php 12,000.00 / person plus 12% VAT

  • Early Registration Payment: Ten-Percent (10%) Discount if PAID thirty (30) days before the training date
  • Group Discount: Five-Percent (5%) on Three (3) or More Participants

 

 
 
 

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Synopsis

Semiconductor or solid-state devices are one of the most important inventions of last century that revolutionized development of the whole world. Almost nothing in the world could operate with using any semiconductor devices. This training is designed for those engineers and researchers with limited knowledge or background in the area. The course will discuss and revisit fundamental concept of solid-state physics, in particular semiconductor physics and follow by giving the operational, device configuration, and application of each common devices in contemporary engineering applications.

Course outcomes:

Upon completion of this course, participants will be able to:

  • List down important factors affecting the performance of a semiconductor device.
  • Explain operational of typical semiconductor devices.
  • Compare functionality of each device.
  • Understand basic characteristics of each device.

Who should attend:

  • Technicians, engineers, and researchers
  • Decision makers, policy makers, and managers

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Pre-requisite

Basic technical background or working experience in a science or engineering discipline.

Course Outline

  • Introduction
  • Semiconductor Physics
  • Basic Building Blocks of Semiconductor Devices
    • Metal-semiconductor (MS)
    • pn Junction
    • Metal-oxide-semiconductor (MOS)
  • Semiconductor Devices:
    • Diode
    • Bipolar Junction Transistor (BJT)
    • Junction Gate Field Effect Transistor (JFET)
    • Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET)
    • Insulated Gate Bipolar Junction Transistor (IGBT)
  • Selected Applications:
    • Light Emitting Diode
    • Solar Cell
    • LASER
    • Memory Device

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DR CHEONG KUAN YEW

Kuan Yew Cheong was born in Ipoh , Perak (1972) and received the B. Eng (1st Hons.) in Materials Engineering from Universiti Sains Malaysia (USM), Malaysia in 1997. After graduation, he worked for two years as a project engineer and quality assurance engineer in a project management company and a semiconductor-device manufacturing factory in Malaysia.

End of 1999, he decided to pursue his postgraduate study (M.Sc.) after being awarded a Fellowship under the Academic Staff Training Scheme from USM. After completion his M.Sc. in Materials Engineering (Thin Film Technology) in 2001, he continued his Ph.D. in the School of Microelectronic Engineering , Griffith University , Australia and the degree was awarded in 2004. This study was fully sponsored by Australian Research Council, USM, and Griffith University Postgraduate Research Scholarship.

In 2005, he was awarded a Certificate of Teaching and Learning from USM. Now he is serving as an Associate Professor at the School of Materials & Mineral Resources Engineering. He is teaching courses of electronic materials, semiconductor fabrication technology, and quality control and management for more than 6 years at under- and post-graduate levels. Dr. Cheong’s main research area is on semiconductor device fabrication, electronic packaging, and characterization. The outcomes of his research have been published in more than 75 high-impact-factor journals and 3 book chapters. Due to his expertise in wide-bandgap semiconductor-based device fabrication technology, for the past six years, he has been invited three times as a Visiting Scientist to Korea Electrotechnology Research Institute (KERI), Korea.

He has also being invited as an Invited Speaker and Keynote Speaker in International Conference on Electronic Materials 2010 (ICEM 2010) – International Union of Materials Research Societies (IUMRS), Korea, CIE & IEM International Seminar on Electrical, Electronic and Energy Saving 2010, Taiwan, and Infineon Technologies (Kulim) Sdn Bhd (IFKM) Technical Symposium 2010, Malaysia. Recently, he has been invited to deliver a Talk on “Investigating Surface Coating and Corrosion Issues Using Surface Analysis (SA) Tools” in Surface Engineering 2011 at Bangkok , Thailand.

He is also a Professional Engineers in Material Engineering disipline who is registered under Board of Engineers, Malaysia.

Outside university, he is very active in professional and community activities. He is a member of Materials Research Society (USA). He was the honorary treasurer for Electron Microscopy Society , Malaysia for year 2005/2006.

Since 2005, he has been elected as one of the Ex-comms of the Institute of Electrical , Electronic Engineers (IEEE) – Component, Package, and Manufacturing Technology (CPMT) Society and Electron Device Society (EDS), Malaysia Chapter.

In addition, he is also the Chairman of the electronic engineering technical division (eETD) under The Institution of Engineers Malaysia (IEM) since 2009. Recently, he has been appointed as a Council Member of IEM and a Standing Committee on Qualification/Admission and Examination/Training.

For the past years, he has involved in organizing a number of local and international conferences and being invited to chair a few technical sessions in those conferences. He is also closely working with Industry through university-industry linkage program and he is delivering technical training courses for local and multinational electronics industries for the past 5 years and more than 350 engineers and researchers have been benefited from those courses.

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Banco de Oro (BDO)

Account Name: AGUILA GROUP COMPANIES (AGC) DEVELOPMENT CORPORATION

Account Number: (Peso) 00 222 800 0844

Swift Code: BNORPHMM

Bank Address: East Mansion Townhouse, Elisco Road, Sto Rosario, Pateros

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